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Blind and Buried Vias

The demand for faster processing times and reduction in size continues to drive the need for increased layer-count in printed circuit boards. One of the results of these design and technology requirements is the need for blind and buried vias. Incorporating blind or buried vias into a multilayer circuit board demands a higher level of innovation in PCB development. To manufacture these types of vias in a multilayer PCB requires either a process of sequential lamination of prepared components, or precise drilling of a completed multilayer PCB. Both methods demand additional time and attention in engineering and manufacturing to produce as compared with lower technology PCBs. Utilizing vias in your multilayer PCBs can significantly increase the number of connections without increasing the size. This brings speed and power to your project without compromise.

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